On the significance of developing boundary layers in integrated water cooled 3D chip stacks - Research Collection

Metadata only

Author

Tiwari, Manish K.

Brunschwiler, Thomas

Poulikakos, Dimos

Date

2012-09

Type

Journal Article

Citations

Cited 16 times in Web of Science

ETH Bibliography

yes

Altmetrics

Publication status

published

External links

https://doi.org/10.1016/j.ijheatmasstransfer.2012.05.029

Journal / series

International Journal of Heat and Mass Transfer

Volume

55(19-20)

Pages / Article No.

5222 - 5232

Publisher

Elsevier

Subject

3D integrated water cooling; Chip stack; CFD; Developing flow; Micro cooling structure; Porous medium

Organisational unit

03462 - Poulikakos, Dimos / Poulikakos, Dimos

Notes

Received 16 April 2012, Accepted 15 May 2012, Available online 13 June 2012.

More

Show all metadata

Citations

Cited 16 times in Web of Science

ETH Bibliography

yes

Altmetrics