On the significance of developing boundary layers in integrated water cooled 3D chip stacks
Publication status
publishedExternal links
Journal / series
International Journal of Heat and Mass TransferVolume
Pages / Article No.
Publisher
ElsevierSubject
3D integrated water cooling; Chip stack; CFD; Developing flow; Micro cooling structure; Porous mediumOrganisational unit
03462 - Poulikakos, Dimos / Poulikakos, Dimos
Notes
Received 16 April 2012, Accepted 15 May 2012, Available online 13 June 2012.More
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