On the significance of developing boundary layers in integrated water cooled 3D chip stacks - Research Collection

Metadata only

Author

Tiwari, Manish K.

Brunschwiler, Thomas

Poulikakos, Dimos

Date

2012-09

Type

Journal Article

Citations

Cited 15 times in Web of Science

ETH Bibliography

yes

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Publication status

published

External links

https://doi.org/10.1016/j.ijheatmasstransfer.2012.05.029

Journal / series

International Journal of Heat and Mass Transfer

Volume

55(19-20)

Pages / Article No.

5222 - 5232

Publisher

Elsevier

Subject

3D integrated water cooling; Chip stack; CFD; Developing flow; Micro cooling structure; Porous medium

Organisational unit

03462 - Poulikakos, Dimos / Poulikakos, Dimos

Notes

Received 16 April 2012, Accepted 15 May 2012, Available online 13 June 2012.

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Citations

Cited 15 times in Web of Science

ETH Bibliography

yes

Altmetrics