On the significance of developing boundary layers in integrated water cooled 3D chip stacks

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Author
Alfieri, Fabio
Tiwari, Manish K.
Zinovik, Igor
Brunschwiler, Thomas
Michel, Bruno
Poulikakos, Dimos
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Date
2012-09
Type
  • Journal Article
Publication status
published
External links
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Journal / series
International Journal of Heat and Mass Transfer
Volume
55(19-20)
Pages
5222 - 5232
Publisher
Elsevier
Subject
3D integrated water cooling; Chip stack; CFD; Developing flow; Micro cooling structure; Porous medium
Organisational unit
03462 - Poulikakos, Dimos
Notes
Received 16 April 2012, Accepted 15 May 2012, Available online 13 June 2012.
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