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dc.contributor.author
Zia, Muneeb
dc.contributor.author
Chi, Taiyun
dc.contributor.author
Park, Jong Seok
dc.contributor.author
Su, Amy
dc.contributor.author
Gonzalez, Joe L.
dc.contributor.author
Jo, Paul K.
dc.contributor.author
Styczynski, Mark P.
dc.contributor.author
Wang, Hua
dc.contributor.author
Bakir, Muhannad S.
dc.date.accessioned
2022-06-27T13:00:03Z
dc.date.available
2022-06-01T16:10:05Z
dc.date.available
2022-06-27T13:00:03Z
dc.date.issued
2016-12
dc.identifier.issn
2156-3950
dc.identifier.issn
2156-3985
dc.identifier.other
10.1109/TCPMT.2016.2626789
en_US
dc.identifier.uri
http://hdl.handle.net/20.500.11850/550281
dc.description.abstract
This paper presents a 3-D integrated disposable “electronic microplate” (e-microplate) platform that allows the reuse of CMOS biosensor, thereby significantly reducing cost and increasing throughput compared to nondisposable biosensing systems. The e-microplate utilizes mechanically flexible interconnects and through-silicon-vias to electrically connect the cells cultured on the top (sensing electrode side) of the e-microplate to the electrodes on the CMOS biosensor while maintaining a physical separation between the aforementioned substrate tiers. Electrical measurements performed show that the incorporation of the e-microplate does not degrade the sensing amplifier's gain, 3-dB bandwidth, or the input referred noise; this ensures a high signal-to-noise ratio allowing accurate sensing of weak signals from living cells under test. Cell growth experiments performed show adhesion and growth of mouse embryonic stem cells on the surface of the sensing electrodes of the e-microplate. Impedance mapping for Dulbecco's phosphate buffered saline solution performed with the e-microplate, for two different e-microplate assemblies, confirms the functional accuracy of the assembled systems.
en_US
dc.language.iso
en
en_US
dc.publisher
IEEE
en_US
dc.subject
3-D integration
en_US
dc.subject
Biosensing
en_US
dc.subject
Disposable
en_US
dc.subject
Electronic microplate (e-microplate)
en_US
dc.title
3-D Integrated electronic microplate platform for low-cost repeatable biosensing applications
en_US
dc.type
Journal Article
dc.date.published
2016-12-01
ethz.journal.title
IEEE Transactions on Components, Packaging and Manufacturing Technology
ethz.journal.volume
6
en_US
ethz.journal.issue
12
en_US
ethz.journal.abbreviated
IEEE trans. compon. packag. manuf. technol. Part B, Adv. packag.
ethz.pages.start
1827
en_US
ethz.pages.end
1833
en_US
ethz.publication.place
New York, NY
en_US
ethz.publication.status
published
en_US
ethz.leitzahl
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02140 - Dep. Inf.technologie und Elektrotechnik / Dep. of Inform.Technol. Electrical Eng.::02636 - Institut für Integrierte Systeme / Integrated Systems Laboratory::09757 - Wang, Hua / Wang, Hua
en_US
ethz.leitzahl.certified
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02140 - Dep. Inf.technologie und Elektrotechnik / Dep. of Inform.Technol. Electrical Eng.::02636 - Institut für Integrierte Systeme / Integrated Systems Laboratory::09757 - Wang, Hua / Wang, Hua
en_US
ethz.date.deposited
2022-06-01T16:10:11Z
ethz.source
BATCH
ethz.eth
no
en_US
ethz.availability
Metadata only
en_US
ethz.rosetta.installDate
2022-06-27T13:00:09Z
ethz.rosetta.lastUpdated
2024-02-02T17:31:52Z
ethz.rosetta.exportRequired
true
ethz.rosetta.versionExported
true
ethz.COinS
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