Parallel packaging of Micro Electro Mechanical Systems

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Author
Taprogge, Jens
Beyeler, Felix
Steinecker, Alexander
Nelson, Bradley J.
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Date
2012
Type
  • Other Conference Item
Publication status
published
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Journal / series
Proc. in Sixth International Precision Assembly Seminar (IPAS2012)
Event
IPAS 2012 — Sixth International Precision Assembly Seminar, Chamonix, France, February 12-14, 2012
Subject
Flip-chip; C-4; Self-alignment; MEMS; MOEMS; No clean; Force sensor; Solder paste; Bismuth; FemtoTools; Wafer level packaging; WLP; Chip scale packaging; CSP; Direct chip attach; DCA; DRIE; SOI
Organisational unit
03627 - Nelson, Bradley J.
Notes
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