Metadata only
Date
2012Type
- Other Conference Item
Altmetrics
Publication status
publishedExternal links
Search via SFX
Journal / series
Proc. in Sixth International Precision Assembly Seminar (IPAS2012)Event
Subject
Flip-chip; C-4; Self-alignment; MEMS; MOEMS; No clean; Force sensor; Solder paste; Bismuth; FemtoTools; Wafer level packaging; WLP; Chip scale packaging; CSP; Direct chip attach; DCA; DRIE; SOIOrganisational unit
03627 - Nelson, Bradley J.
Notes
.More
Show all metadata
Altmetrics