Parallel packaging of Micro Electro Mechanical Systems
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Date
2012Type
- Other Conference Item
ETH Bibliography
yes
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Publication status
publishedJournal / series
Proc. in Sixth International Precision Assembly Seminar (IPAS2012)Event
Subject
Flip-chip; C-4; Self-alignment; MEMS; MOEMS; No clean; Force sensor; Solder paste; Bismuth; FemtoTools; Wafer level packaging; WLP; Chip scale packaging; CSP; Direct chip attach; DCA; DRIE; SOIOrganisational unit
03627 - Nelson, Bradley J. / Nelson, Bradley J.
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ETH Bibliography
yes
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