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dc.contributor.author
Klösel, Katrina
dc.contributor.author
Roman, Cosmin
dc.contributor.author
Hierold, Christofer
dc.date.accessioned
2023-10-17T08:23:26Z
dc.date.available
2023-08-22T03:09:24Z
dc.date.available
2023-08-24T09:13:25Z
dc.date.available
2023-10-17T08:23:26Z
dc.date.issued
2023-10
dc.identifier.issn
1057-7157
dc.identifier.issn
1941-0158
dc.identifier.other
10.1109/JMEMS.2023.3292585
en_US
dc.identifier.uri
http://hdl.handle.net/20.500.11850/627525
dc.identifier.doi
10.3929/ethz-b-000627525
dc.description.abstract
Here we present a sensor concept for simultaneous heat flux and temperature acquisition based on the thermoelectric and thermoresistive effect in n-type orthorhombic Bi2Se3. Measurements were performed in the 283-343 K temperature range. Temperature sensitivities as high as -36700 ppm/K (equivalent to a beta-value of 3260 K) and heat flux sensitivities of 0.125 mu V/(W/m(2)) were determined. The temperature and heat flux accuracies were found to be +/- 0.6 K and +/- 20 W (through a 1cm x 1cm area, equiv. to +/- 1 K) and the resolution was determined to be around 0.05 K. The underlying physical mechanisms were further investigated and a deep donor level with ionization energy of 0.292 eV was identified leading to a strong temperature-dependence of donor ionization. The presented device architecture has the potential to be utilized in applications where dual-mode simultaneous temperature and heat flux measurements are beneficial. [2023-0093]
en_US
dc.format
application/pdf
en_US
dc.language.iso
en
en_US
dc.publisher
IEEE
en_US
dc.rights.uri
http://creativecommons.org/licenses/by/4.0/
dc.subject
Thermistors
en_US
dc.subject
Thermoelectric devices
en_US
dc.subject
Microsensors
en_US
dc.subject
Semiconductor materials
en_US
dc.subject
thermoresistivity
en_US
dc.subject
Electrochemical processes
en_US
dc.title
Thermoelectric and Thermoresistive Effect in Bi2Se3: A Novel Dual-Mode Temperature and Heat Flux Sensor
en_US
dc.type
Journal Article
dc.rights.license
Creative Commons Attribution 4.0 International
dc.date.published
2023-07-14
ethz.journal.title
Journal of Microelectromechanical Systems
ethz.journal.volume
32
en_US
ethz.journal.issue
5
en_US
ethz.pages.start
445
en_US
ethz.pages.end
453
en_US
ethz.version.deposit
publishedVersion
en_US
ethz.identifier.wos
ethz.identifier.scopus
ethz.publication.place
New York, NY
en_US
ethz.publication.status
published
en_US
ethz.leitzahl
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02130 - Dep. Maschinenbau und Verfahrenstechnik / Dep. of Mechanical and Process Eng.::03609 - Hierold, Christofer / Hierold, Christofer
ethz.leitzahl.certified
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02130 - Dep. Maschinenbau und Verfahrenstechnik / Dep. of Mechanical and Process Eng.::03609 - Hierold, Christofer / Hierold, Christofer
ethz.relation.isSupplementedBy
10.3929/ethz-b-000636958
ethz.date.deposited
2023-08-22T03:09:27Z
ethz.source
WOS
ethz.eth
yes
en_US
ethz.availability
Open access
en_US
ethz.rosetta.installDate
2023-10-17T08:23:29Z
ethz.rosetta.lastUpdated
2024-02-03T05:19:05Z
ethz.rosetta.versionExported
true
ethz.COinS
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