Integrated compact modelling of a planar-gate non-punch-through 3.3kV-1200A IGBT module for insightful analysis and realistic interpretation of the failure mechanisms
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Date
2007Type
- Other Conference Item
Publication status
publishedExternal links
Journal / series
PROCEEDINGS OF THE 19TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICSPages / Article No.
Publisher
IEEEEvent
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