Integrated compact modelling of a planar-gate non-punch-through 3.3kV-1200A IGBT module for insightful analysis and realistic interpretation of the failure mechanisms - Research Collection

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Author

Castellazzi, A.

Ciappa, M.

Fichtner, W.

Urresti-Ibanez, J.

Mermet-Guyennet, M.

Castellazzi, A.

Ciappa, M.

Fichtner, W.

Urresti-Ibanez, J.

Mermet-Guyennet, M.

Date

2007

Type

Other Conference Item

Citations

Cited 2 times in Web of Science

ETH Bibliography

yes

Altmetrics

Publication status

published

External links

https://doi.org/10.1109/ISPSD.2007.4294950

Journal / series

PROCEEDINGS OF THE 19TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS

Pages / Article No.

133 - 136

Publisher

IEEE

Event

19th International Symposium on Power Semiconductor Devices and ICs, Cheju, Isl, South Korea, May 27-30, 2007

Notes

.

More

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Citations

Cited 2 times in Web of Science

ETH Bibliography

yes

Altmetrics