Numerical modeling of 3D integrated water cooling of electronic chip stacks

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Author
Alfieri, Fabio
Date
2013
Type
    Doctoral Thesis
Rights / license
In Copyright - Non-Commercial Use Permitted
Permanent link
https://doi.org/10.3929/ethz-a-009910080
Publication status
published
External links
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Contributors
Examiner: Michel, Bruno
Examiner: Poulikakos, Dimosthenis
Publisher
ETH
Subject
MICROFLUIDICS AND NANOFLUIDICS; COOLING/ELECTRONIC EQUIPMENTS; TURBULENTE STRÖMUNG (FLUIDDYNAMIK); CHIP STACKS (MICROELECTRONICS); STAPELSPEICHERCHIPS (MIKROELEKTRONIK); REYNOLDS NUMBER (FLUID DYNAMICS); MIKROFLUIDIK UND NANOFLUIDIK; KÜHLUNG/ELEKTRONISCHE AUSRÜSTUNGEN; TURBULENT FLOW (FLUID DYNAMICS); FLUIDBEWEGUNG IN PORÖSEN STOFFEN (HYDRODYNAMIK); REYNOLDS-ZAHL (FLUIDDYNAMIK); FLOW THROUGH POROUS MEDIA (HYDRODYNAMICS)
Organisational unit
02130 - Dep. Maschinenbau und Verfahrenstechnik / Dep. of Mechanical and Process Eng.
03462 - Poulikakos, Dimos / Poulikakos, Dimos  
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