Sub-THz transceiver design for future generation mobile communications

Abstract

This paper outlines the design considerations necessary to realize an innovative transceiver prototype for future-generation mobile communication, adeptly harnessing the spectrum beyond 100 GHz. The primary innovations and challenges reside in maximizing the efficacy of BiCMOS and indium phosphide technologies, advanced radio frequency (RF) packaging, and the design of high-performance D-band RF frontends. The selection of RF-chip technologies and the integration of densely packed RF packaging are thoroughly defined and justified. Specifications for both transmitter and receiver systems are derived from a meticulous link budget analysis. These preliminary studies and decisions inform the forthcoming tape-outs in this project. The focus remains on developing key transceiver technologies to drive the next generation of mobile communications, surpassing the capabilities of 5G. This includes enhancing data rates, power efficiency, integration density, and minimizing footprint.