Acceleration Of The Curing Process Of A Paste Adhesive For Aerospace Applications Considering Cure Dependent Void Formations
Metadata only
Datum
2014Typ
- Journal Article
Publikationsstatus
publishedExterne Links
Zeitschrift / Serie
International Journal of Adhesion and AdhesivesBand
Seiten / Artikelnummer
Verlag
ElsevierThema
Epoxy paste adhesive; Curing process; Induction heating; Void formationOrganisationseinheit
03507 - Ermanni, Paolo (emeritus) / Ermanni, Paolo (emeritus)
Anmerkungen
Accepted 16 July 2013, Published online 27 September 2013.