Acceleration Of The Curing Process Of A Paste Adhesive For Aerospace Applications Considering Cure Dependent Void Formations - Research Collection

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Author

Sánchez Cebrián, Alberto

Klunker, Florian

Date

2014

Type

Journal Article

Citations

Cited 12 times in Scopus

ETH Bibliography

yes

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Publication status

published

External links

https://doi.org/10.1016/j.ijadhadh.2013.09.029

Journal / series

International Journal of Adhesion and Adhesives

Volume

48

Pages / Article No.

51 - 58

Publisher

Elsevier

Subject

Epoxy paste adhesive; Curing process; Induction heating; Void formation

Organisational unit

03507 - Ermanni, Paolo (emeritus) / Ermanni, Paolo (emeritus)

Notes

Accepted 16 July 2013, Published online 27 September 2013.

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Show all metadata

Citations

Cited 12 times in Scopus

ETH Bibliography

yes

Altmetrics