Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks
Publication status
publishedExternal links
Journal / series
International Journal of Heat and Mass TransferVolume
Pages / Article No.
Publisher
ElsevierSubject
Micro-LIF; Vortex shedding; Microscale flows; 3D integrated cooling; ElectronicsOrganisational unit
03462 - Poulikakos, Dimos (emeritus) / Poulikakos, Dimos (emeritus)
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