Photonic wire bonding: Connecting nanophotonic circuits across chip boundaries
Metadata only
Author
Koos, C.
Leuthold, J.
Freude, W.
Lindenmann, N.
Koeber, S.
Balthasar, G.
Hoffmann, J.
Hoose, T.
Huebner, P.
Hillerkuss, D.
Schmogrow, R.
Date
2013Type
- Conference Paper
Publication status
publishedEditor
Freymann, Georg von
Schoenfeld, Winston V.
Rumpf, Raymond C.
Book title
Advanced fabrication technologies for micro/nano optics and photonics VI : 5-6 February 2013, San Francisco, California, United StatesJournal / series
Proceedings of SPIEVolume
Pages
Publisher
SPIEEvent
Subject
Photonic integration; Two-photon polymerization; Photonic wire bonding; Silicon photonics; Optical packaging; Multi-chip integration; Direct laser writing; 3D nanofabricationOrganisational unit
03974 - Leuthold, Juerg
Notes
.More
Show all metadata