Photonic wire bonding: Connecting nanophotonic circuits across chip boundaries

Thumbnail
Metadata only
Author
Koos, C.
Leuthold, Juergcc
Freude, W.
Lindenmann, N.
Koeber, S.
Balthasar, G.
Hoffmann, J.
Hoose, T.
Huebner, P.
Hillerkuss, D.
Schmogrow, R.
Show all
Date
2013
Type
  • Conference Paper
Publication status
published
External links
Search via SFX
Editor
Freymann, Georg von
Schoenfeld, Winston V.
Rumpf, Raymond C.
Book title
Advanced fabrication technologies for micro/nano optics and photonics VI : 5-6 February 2013, San Francisco, California, United States
Journal / series
Proceedings of SPIE
Volume
8613
Pages / Article No.
86130W
Publisher
SPIE
Event
Advanced Fabrication Technologies for Micro/Nano Optics and Photonics VI, San Francisco, CA, USA, February 5-6, 2013
Subject
Photonic integration; Two-photon polymerization; Photonic wire bonding; Silicon photonics; Optical packaging; Multi-chip integration; Direct laser writing; 3D nanofabrication
Organisational unit
03974 - Leuthold, Juerg / Leuthold, Juerg  
Notes
.
More
Show all metadata
Citations
Cited 3 times in Web of Science
ETH Bibliography
no
Altmetrics