Photonic wire bonding: Connecting nanophotonic circuits across chip boundaries

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Author
Koos, C.
Leuthold, J.
Freude, W.
Lindenmann, N.
Koeber, S.
Balthasar, G.
Hoffmann, J.
Hoose, T.
Huebner, P.
Hillerkuss, D.
Schmogrow, R.
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Date
2013
Type
  • Conference Paper
Publication status
published
External links
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Editor
Freymann, Georg von
Schoenfeld, Winston V.
Rumpf, Raymond C.
Book title
Advanced fabrication technologies for micro/nano optics and photonics VI : 5-6 February 2013, San Francisco, California, United States
Journal / series
Proceedings of SPIE
Volume
8613
Pages / Article No.
86130W
Publisher
SPIE
Event
Advanced Fabrication Technologies for Micro/Nano Optics and Photonics VI, San Francisco, CA, USA, February 5-6, 2013
Subject
Photonic integration; Two-photon polymerization; Photonic wire bonding; Silicon photonics; Optical packaging; Multi-chip integration; Direct laser writing; 3D nanofabrication
Organisational unit
03974 - Leuthold, Juerg / Leuthold, Juerg  
Notes
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Citations
Cited 3 times in Web of Science
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