Modeling of void formation during the curing process of paste adhesives - Research Collection

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Author

Sánchez Cebrián, Alberto

Klunker, Florian

Zogg, Markus

Date

2014

Type

Journal Article

Citations

Cited 0 times in Web of Science

ETH Bibliography

yes

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Publication status

published

External links

https://doi.org/10.1080/01694243.2013.868333

Journal / series

Journal of Adhesion Science and Technology

Volume

28(7)

Pages / Article No.

731 - 747

Publisher

VSP

Organisational unit

03507 - Ermanni, Paolo / Ermanni, Paolo

Notes

Received 12 July 2013, Accepted 19 November 2013, Published online 17 December 2013.

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Citations

Cited 0 times in Web of Science

ETH Bibliography

yes

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