Modeling of void formation during the curing process of paste adhesives

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Author
Sánchez Cebrián, Alberto
Klunker, Florian
Zogg, Markus
Date
2014
Type
  • Journal Article
Publication status
published
External links
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Journal / series
Journal of Adhesion Science and Technology
Volume
28(7)
Pages
731 - 747
Publisher
VSP
Organisational unit
03507 - Ermanni, Paolo
Notes
Received 12 July 2013, Accepted 19 November 2013, Published online 17 December 2013.
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