Smart-power device model coupling compact, distributed and logic level description
- Other Conference Item
This paper proposes the multi-level-abstraction electro-thermal model of an integrated power device. Thermal aspects are rendered with a distributed 3D description and coupled both with analytical and logic equations. A comparison of measurements and simulation results demonstrates the validity of the chosen approach, based on VHDL-AMS. Show more
Book title2007 International Semiconductor Device Research Symposium
Pages / Article No.
Organisational unit03228 - Fichtner, Wolfgang
MoreShow all metadata