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Analyzing the Theoretical Limits of Forced Air-Cooling by Employing Advanced Composite Materials with Thermal Conductivities > 400W/mK.
(2006)CIPS 2006 : 4th International Conference on Integrated Power Systems - June 7-9, 2006, Naples, Italy - ProceedingsConference Paper -
Modelling the thermal coupling between internal power semiconductor dies of a water-cooled 3300V/1200A HiPak IGBT module
(2007)International Exhibition and Conference for Power Electronics, Intelligent Motion and Power Quality (PCIM Europe 2007)Conference Paper -
12-Pulse rectifier for more electric aircraft applications
(2003)Proceedings of the IEEE International Conference on Industrial TechnologyConference Paper -
Thermal analysis of a multi-chip Si/SiC-power module for realization of a bridge leg of a 10 kW Vienna rectifier
(2003)INTELEC 03, the 25th International Telecommunications Energy Conference, Powering the Broadband Network / ProceedingsConference Paper -
A Novel Bi-Directional Three-Phase Active Third-Harmonic Injection High Input Current Quality AC-DC Converter
(2003)PCIM 2003 Europe: Official Proceedings of the Ninth European Power Quality ConferenceConference Paper -
A Thermal Model of a Forced-Cooled Heat Sink for Transient Temperature Calculations Employing a Circuit Simulator
(2006)IEEJ Transactions on Industry ApplicationsConference Paper -
Interactive Animation Program for Power Electronics Education and Self-Learning
(2002)Proceedings of the Annual Conference IEE Japan (IEEJ 2002), Kagoshima, JapanConference Paper -
Design Tools for Power Electronics: Trends and Innovations
(2007)Proceedings - 2nd International Conference Automotive Power ElectronicsConference Paper -
Thermal Power Density Barriers of Converter Systems
(2008)ETG-Fachbericht ~ Proceedings of the 5th International Conference on Integrated Power Electronics Systems (CIPS 2008), Nuremberg, Germany, March 11-13, 2008Conference Paper -
New Web-Based Interactive E-Learning in Power Electronics and Electrical Machines
(2001)Conference Record of the 2001 IEEE Industry Applications Conference (IAS 2001)Conference Paper