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dc.contributor.author
Locher, Ivo
dc.contributor.author
Tröster, Gerhard
dc.date.accessioned
2017-06-08T18:13:41Z
dc.date.available
2017-06-08T18:13:41Z
dc.date.issued
2007-08
dc.identifier.issn
1521-3323
dc.identifier.issn
1557-9980
dc.identifier.other
10.1109/TADVP.2007.898636
dc.identifier.uri
http://hdl.handle.net/20.500.11850/8509
dc.language.iso
en
dc.publisher
IEEE
dc.subject
Interposer technology
dc.subject
System-on-textile
dc.subject
Textile interconnects
dc.subject
Textile substrates
dc.subject
Wearable computing
dc.title
Fundamental building blocks for circuits on textiles
dc.type
Journal Article
ethz.journal.title
IEEE Transactions on Advanced Packaging
ethz.journal.volume
30
ethz.journal.issue
3
ethz.journal.abbreviated
IEEE trans. adv. packaging
ethz.pages.start
541
ethz.pages.end
550
ethz.notes
Manuscript received 20 February 2006, Revised 4 October 2006.
ethz.identifier.wos
ethz.identifier.nebis
002039675
ethz.publication.place
New York
ethz.publication.status
published
ethz.leitzahl
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02140 - Dep. Inf.technologie und Elektrotechnik / Dep. of Inform.Technol. Electrical Eng.::02634 - Institut für Elektronik / Institute for Electronics::03388 - Tröster, Gerhard (emeritus)
ethz.leitzahl.certified
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02140 - Dep. Inf.technologie und Elektrotechnik / Dep. of Inform.Technol. Electrical Eng.::02634 - Institut für Elektronik / Institute for Electronics::03388 - Tröster, Gerhard (emeritus)
ethz.date.deposited
2017-06-08T18:14:00Z
ethz.source
ECIT
ethz.identifier.importid
imp59364bc89e88475630
ethz.ecitpid
pub:19261
ethz.eth
yes
ethz.availability
Metadata only
ethz.rosetta.installDate
2017-07-12T23:11:57Z
ethz.rosetta.lastUpdated
2021-02-14T05:04:50Z
ethz.rosetta.versionExported
true
ethz.COinS
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