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dc.contributor.author
Buzzo, Marco
dc.contributor.author
Ciappa, Mauro
dc.contributor.author
Fichtner, Wolfgang
dc.date.accessioned
2017-06-11T10:07:07Z
dc.date.available
2017-06-11T10:07:07Z
dc.date.issued
2005
dc.identifier.isbn
0-7803-9301-5
dc.identifier.uri
http://hdl.handle.net/20.500.11850/85826
dc.language.iso
en
dc.publisher
IEEE Operations Center
dc.title
2D junction delineation for the failure analysis of silicon carbide devices
dc.type
Conference Paper
ethz.book.title
Tung, C.-H.: Proceedings of the 12th International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA)
ethz.pages.start
105
ethz.pages.end
109
ethz.event
12th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA 2005
ethz.event.location
Singapore
ethz.event.date
June 27 - July 1, 2005
ethz.identifier.nebis
005065566
ethz.publication.place
Piscataway, NJ
ethz.publication.status
published
ethz.leitzahl
03228 - Fichtner, Wolfgang
ethz.leitzahl.certified
03228 - Fichtner, Wolfgang
ethz.date.deposited
2017-06-11T10:09:01Z
ethz.source
ECIT
ethz.identifier.importid
imp593652086eac836940
ethz.ecitpid
pub:135160
ethz.eth
yes
ethz.availability
Metadata only
ethz.rosetta.installDate
2017-08-03T08:47:32Z
ethz.rosetta.lastUpdated
2017-08-03T08:47:32Z
ethz.rosetta.versionExported
true
ethz.COinS
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