Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures
- Journal Article
Journal / seriesIEEE Transactions on Microwave Theory and Techniques
Pages / Article No.
SubjectBoundary modeling; Generalized T-matrix; High-speed electronic package modeling; Modal expansion; Signal and power integrity; Via coupling
NotesManuscript received May 29 2008, Revised September 11 2008 and December.
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