Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures
Metadata only
Date
2009-07Type
- Journal Article
Publication status
publishedExternal links
Journal / series
IEEE Transactions on Microwave Theory and TechniquesVolume
Pages / Article No.
Publisher
IEEESubject
Boundary modeling; Generalized T-matrix; High-speed electronic package modeling; Modal expansion; Signal and power integrity; Via couplingNotes
Manuscript received May 29 2008, Revised September 11 2008 and December.More
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