3D Integration of Power Semiconductor Devices based on Surface Bump Technology
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Author / Producer
Date
2008
Publication Type
Conference Paper
ETH Bibliography
yes
Citations
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Data
Rights / License
Permanent link
Publication status
published
External links
Editor
Book title
CIPS 2008. 5th International Conference on Integrated Power Electronics Systems
Journal / series
Volume
111
Pages / Article No.
127 - 132
Publisher
VDE Verlag
Event
5th International Conference on Integrated Power Electronics Systems (CIPS 2008)
Edition / version
Methods
Software
Geographic location
Date collected
Date created
Subject
Organisational unit
03228 - Fichtner, Wolfgang (emeritus)