Resource-Efficient Cross-Platform Verification with Modular Superconducting Devices
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Date
2025-11-25
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Data Collection
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Abstract
Large-scale quantum computers are expected to benefit from modular architectures. Validating the capabilities of modular devices requires benchmarking strategies that assess performance within and between modules. In this work, we evaluate cross-platform verification protocols, which are critical for quantifying how accurately different modules prepare the same quantum state — a key requirement for modular scalability and system-wide consistency. We demonstrate these algorithms
using a six-qubit flip-chip superconducting quantum device consisting of two three-qubit modules on a single carrier chip, with connectivity for intra- and inter-module entanglement. We examine how the resource requirements of protocols relying solely on classical communication between modules scale exponentially with qubit number, and demonstrate that introducing an inter-module two qubit gate enables sub-exponential scaling in cross-platform verification. This approach reduces the number of repetitions required by a factor of four for three-qubit states, with greater reductions projected for larger and higher-fidelity devices.
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Contributors
Contact person: Dalton, Kieran
Project leader: Wallraff, Andreas
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Pages / Article No.
Publisher
ETH Zurich
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Geographic location
Date collected
2024/2025
Date created
2024/2025
Subject
Superconducting qubits; Quantum computing
Organisational unit
03720 - Wallraff, Andreas / Wallraff, Andreas
Notes
Funding
UEM019-11 - Modular Quantum Computing with Superconducting Circuits (ModQC) (SBFI)
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