Laser Sintering of Dip-Based All-Copper Interconnects
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Author / Producer
Date
2018
Publication Type
Conference Paper
ETH Bibliography
yes
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Rights / License
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Publication status
published
External links
Editor
Book title
Proceedings - The 2018 68th Electronic Components and Technology Conference
Journal / series
Volume
Pages / Article No.
279 - 286
Publisher
IEEE
Event
68th IEEE Electronic Components and Technology Conference (ECTC 2018)
Edition / version
Methods
Software
Geographic location
Date collected
Date created
Subject
advanced flip-chip packaging; flip-chip electrical interconnects; all-copper interconnects; dip-based all-copper interconnects; laser sintering; copper nano-and microparticles; transient thermal finite element model