Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules
Metadata only
Datum
2015Typ
- Other Conference Item
Publikationsstatus
publishedExterne Links
Buchtitel
2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)Seiten / Artikelnummer
Verlag
IEEEKonferenz
Organisationseinheit
03380 - Huang, Qiuting (emeritus) / Huang, Qiuting (emeritus)