Three-dimensional nanosprings for electromechanical sensors

Abstract

This paper presents the use of a novel fabrication technique to make three-dimensional nanostructures with nanoscale features that can be used for electromechanical sensors. The process uses conventional microfabrication techniques to create a planar pattern in a SiGe/Si bilayer that then self-assembles into three-dimensional (3D) structures during a wet etch release. An additional metal layer is integrated for higher conductivity. Results from the fabrication of the structures are demonstrated. Nanomanipulation inside an SEM was conducted to probe the structures for mechanical and electrical characterization. The experimental characterization results were validated by finite element simulation results.