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dc.contributor.author
Bufler, Fabian M.
dc.contributor.author
Schenk, Andreas
dc.contributor.author
Fichtner, Wolfgang
dc.contributor.editor
Wachutka, Gerhard
dc.contributor.editor
Schrag, Gabriele
dc.date.accessioned
2023-08-03T10:57:38Z
dc.date.available
2017-06-09T10:55:22Z
dc.date.available
2023-08-03T10:57:38Z
dc.date.issued
2004
dc.identifier.isbn
978-3-7091-7212-4
en_US
dc.identifier.isbn
978-3-7091-0624-2
en_US
dc.identifier.other
10.1007/978-3-7091-0624-2_44
en_US
dc.identifier.uri
http://hdl.handle.net/20.500.11850/34517
dc.description.abstract
Full—band Monte Carlo simulations are performed for n—type FinFETs as well as for unstrained—Si and strained—Si fully—depleted (FD) SOI-MOSFETs. Gate lengths of 50 nm down to 10 nm are considered, and a fixed off—current of 100 nA/μzm is in each case ensured by adjusting the silicon film thickness. The FinFET shows the best scaling trend, but the strained-Si FDSOI-MOSFET always involves the largest absolute value for the on—current. However, the on—current decreases upon scaling to 10 nm which might stem from a larger influence of surface roughness scattering in thin Si films affecting most strongly quasi—ballistic transport in strained Si. The feature of a decreasing current is found to be absent in drift—diffusion simulation because this approach does not include quasi—ballistic transport.
en_US
dc.language.iso
en
en_US
dc.publisher
Springer
en_US
dc.title
Scalability of FinFETs and Unstrained–Si/Strained–Si FDSOI–MOSFETs
en_US
dc.type
Conference Paper
ethz.book.title
Simulation of Semiconductor Processes and Devices 2004
en_US
ethz.pages.start
195
en_US
ethz.pages.end
198
en_US
ethz.event
10th International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004)
en_US
ethz.event.location
Munich, Germany
en_US
ethz.event.date
September 2-4, 2004
en_US
ethz.identifier.wos
ethz.publication.place
Vienna
en_US
ethz.publication.status
published
en_US
ethz.date.deposited
2017-06-09T10:55:30Z
ethz.source
ECIT
ethz.identifier.importid
imp59364e0056a9697163
ethz.ecitpid
pub:55524
ethz.eth
yes
en_US
ethz.availability
Metadata only
en_US
ethz.rosetta.installDate
2017-07-19T01:36:35Z
ethz.rosetta.lastUpdated
2024-02-03T02:15:34Z
ethz.rosetta.versionExported
true
ethz.COinS
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