A Thermal Model of a Forced-Cooled Heat Sink for Transient Temperature Calculations Employing a Circuit Simulator
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Date
2006Type
- Conference Paper
ETH Bibliography
yes
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Publication status
publishedExternal links
Journal / series
IEEJ Transactions on Industry ApplicationsVolume
Pages / Article No.
Publisher
The Institute of Electrical Engineers of JapanEvent
Subject
heat sink; dynamic thermal model; thermal coupling; thermal hot spot; heat transfer coefficientOrganisational unit
03573 - Kolar, Johann W. / Kolar, Johann W.
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ETH Bibliography
yes
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