Analysis of PCB embedded power semiconductors for a 30 kW boost PFC converter
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Date
2016
Publication Type
Conference Paper
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yes
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Abstract
Packages of power semiconductors have considerable influence regarding the thermal impedance, the parasitic inductance, which affects the switching losses, and the reliability. In this paper, the performance of a phase leg of a PFC rectifier with PCB embedded power semiconductors is investigated. The mechanical stress in the PCB is analyzed by a FEM simulation and PCB design guidelines are given. The thermal impedance, parasitic inductance and switching losses of a real test setup are measured and compared with commercial modules. Based on this data, an optimization of a PFC rectifier with respect to volume, including the EMI filter, is performed for a converter using PCB embedded power semiconductors and compared to a converter using power semiconductors with conventional packaging. The converter using PCB embedded power semiconductors achieves a 21% lower volume compared to a converter using power semiconductors with conventional packaging.
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published
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Editor
Book title
2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe)
Journal / series
Volume
Pages / Article No.
7695519
Publisher
IEEE
Event
18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe)
Edition / version
Methods
Software
Geographic location
Date collected
Date created
Subject
Integration; IGBT; Power factor correction; Optimization; Reliability
Organisational unit
03889 - Biela, Jürgen / Biela, Jürgen