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dc.contributor.author
Zürcher, Jonas
dc.contributor.author
Chen, Xi
dc.contributor.author
Burg, Brian R.
dc.contributor.author
Zimmermann, Severin
dc.contributor.author
Brunschwiler, Thomas
dc.contributor.author
Hong, Guo
dc.contributor.author
Studart, André R.
dc.contributor.author
Potasiewicz, Grzegorz
dc.contributor.author
Warszynski, Piotr
dc.date.accessioned
2017-06-12T05:29:28Z
dc.date.available
2017-06-12T05:29:28Z
dc.date.issued
2015
dc.identifier.other
10.1109/NANO.2015.7388670
dc.identifier.uri
http://hdl.handle.net/20.500.11850/116065
dc.language.iso
en
dc.publisher
IEEE
dc.subject
Alumina
dc.subject
Nanoassemblies
dc.subject
Nanopackaging
dc.subject
Thermal Packaging
dc.subject
Underfill
dc.title
Enhanced thermal underfills by bridging nanoparticle assemblies in percolating microparticle beds
dc.type
Conference Paper
ethz.book.title
Proceedings of the 15th IEEE International Conference on Nanotechnology (IEEE-NANO 2015)
ethz.pages.start
577
ethz.pages.end
580
ethz.event
IEEE 15th International Conference on Nanotechnology, IEEE-NANO 2015
ethz.event.location
Rome, Italy
ethz.event.date
July 27-30, 2015
ethz.identifier.scopus
ethz.publication.place
Piscataway, NJ
ethz.publication.status
published
ethz.date.deposited
2017-06-12T05:34:08Z
ethz.source
ECIT
ethz.identifier.importid
imp5936545f458c471444
ethz.ecitpid
pub:177918
ethz.eth
yes
ethz.availability
Metadata only
ethz.rosetta.installDate
2017-07-15T03:48:22Z
ethz.rosetta.lastUpdated
2020-02-14T16:52:07Z
ethz.rosetta.versionExported
true
ethz.COinS
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