3D integrated water cooling of a composite multilayer stack of chips

Metadata only

Author

Date

2010-12

Type

Journal Article

ETH Bibliography

yes

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Publication status

published

External links

Journal / series

Journal of Heat Transfer

Volume

132(12)

Pages / Article No.

121402

Publisher

American Society of Mechanical Engineers

Subject

computational fluid dynamics; cooling; microchannel flow; porous materials; thermal conductivity

Organisational unit

03462 - Poulikakos, Dimos / Poulikakos, Dimos

Notes

Received 9 February 2010, Revised 21 July 2010, Published 22 September 2010.

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ETH Bibliography

yes

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