Study of Mutual Coupling on Mobile Phone PCB with Shielding Using FDTD
dc.contributor.author
Li, Chung-Huan
dc.contributor.author
Jekkonen, Jari
dc.contributor.author
Tudosie, George
dc.contributor.author
Chavannes, Nicolas
dc.contributor.author
Kuster, Niels
dc.date.accessioned
2017-06-09T09:08:24Z
dc.date.available
2017-06-09T09:08:24Z
dc.date.issued
2010
dc.identifier.isbn
978-1-4244-6305-3
dc.identifier.other
10.1109/ISEMC.2010.5711311
dc.identifier.uri
http://hdl.handle.net/20.500.11850/29458
dc.language.iso
en
dc.publisher
IEEE
dc.title
Study of Mutual Coupling on Mobile Phone PCB with Shielding Using FDTD
dc.type
Conference Paper
ethz.book.title
2010 IEEE International Symposium on Electromagnetic Compatibility (EMC)
ethz.pages.start
419
ethz.pages.end
424
ethz.event
2010 IEEE International Symposium on Electromagnetic Compatibility (EMC)
ethz.event.location
Fort Lauderdale, FL, USA
ethz.event.date
July 25-30, 2010
ethz.publication.place
Piscataway, NJ
ethz.publication.status
published
ethz.leitzahl
03228 - Fichtner, Wolfgang
ethz.leitzahl.certified
03228 - Fichtner, Wolfgang
ethz.date.deposited
2017-06-09T09:08:44Z
ethz.source
ECIT
ethz.identifier.importid
imp59364d9a4aa5b48932
ethz.ecitpid
pub:48901
ethz.eth
yes
ethz.availability
Metadata only
ethz.rosetta.installDate
2017-07-15T08:02:30Z
ethz.rosetta.lastUpdated
2024-02-01T16:46:44Z
ethz.rosetta.versionExported
true
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Conference Paper [34959]