Characterization of electroplated diamond wires and the resulting workpiece quality in silicon sawing
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Date
2020-02Type
- Journal Article
Publication status
publishedExternal links
Journal / series
Journal of Materials Processing TechnologyVolume
Pages / Article No.
Publisher
ElsevierSubject
Diamond wire; Wire sawing; Silicon; Material Removal; Ductile removal; Wire speedOrganisational unit
03641 - Wegener, Konrad (emeritus) / Wegener, Konrad (emeritus)
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