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dc.contributor.author
Risch, Raffael
dc.contributor.author
Biela, Jürgen
dc.date.accessioned
2022-04-14T12:40:54Z
dc.date.available
2019-12-04T09:15:59Z
dc.date.available
2019-12-04T09:38:48Z
dc.date.available
2020-03-16T08:30:05Z
dc.date.available
2021-08-12T06:40:30Z
dc.date.available
2022-04-14T12:25:43Z
dc.date.available
2022-04-14T12:40:54Z
dc.date.issued
2019
dc.identifier.isbn
978-9-0758-1531-3
en_US
dc.identifier.isbn
978-9-0758-1530-6
en_US
dc.identifier.isbn
978-1-7281-2361-5
en_US
dc.identifier.other
10.23919/epe.2019.8914901
en_US
dc.identifier.uri
http://hdl.handle.net/20.500.11850/382509
dc.identifier.doi
10.3929/ethz-b-000382509
dc.description.abstract
In pulsed power systems, nanosecond switching transients are required to meet the demanding pulse specifications of voltage rise and fall times. To achieve these fast transients, SiC MOSFETs are promising semiconductor devices due to their high intrinsic switching speed. However, the parasitics of the semiconductor chip, the package and the board layout limit the achievable switching times. So far, no low inductive designs have been used to investigate the switching speed limits of SiC MOSFETs in pulsed power applications. Therefore, this paper focuses on the limits of the output voltage switching speed of a chopper type half bridge with an ohmic load, which is the fundamental switching cell of many solid-state pulse generators. The modelling of the half bridge is described and a linearized analytical model is presented for calculating the output voltage switching speed. For verification of the theoretical analysis, a sandwiched power module is built using a SiC MOSFET in a low inductive PCB-package.
en_US
dc.format
application/pdf
en_US
dc.language.iso
en
en_US
dc.publisher
IEEE
en_US
dc.rights.uri
http://rightsstatements.org/page/InC-NC/1.0/
dc.subject
Design
en_US
dc.subject
MOSFET
en_US
dc.subject
Packaging
en_US
dc.subject
Pulsed power
en_US
dc.subject
Power semiconductor device
en_US
dc.subject
Silicon Carbide (SiC)
en_US
dc.subject
Wide bandgap devices
en_US
dc.title
Nanosecond switching of ohmic loads using SiC MOSFETs in ultra-low inductive PCB-packages
en_US
dc.type
Conference Paper
dc.rights.license
In Copyright - Non-Commercial Use Permitted
dc.date.published
2019-11-28
ethz.book.title
2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)
en_US
ethz.pages.start
8914901
en_US
ethz.size
10 p.
en_US
ethz.version.deposit
acceptedVersion
en_US
ethz.event
21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)
en_US
ethz.event.location
Genova, Italy
en_US
ethz.event.date
September 3-5, 2019
en_US
ethz.identifier.wos
ethz.identifier.scopus
ethz.publication.place
Piscataway, NJ
en_US
ethz.publication.status
published
en_US
ethz.leitzahl
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02140 - Dep. Inf.technologie und Elektrotechnik / Dep. of Inform.Technol. Electrical Eng.::03889 - Biela, Jürgen / Biela, Jürgen
en_US
ethz.leitzahl.certified
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02140 - Dep. Inf.technologie und Elektrotechnik / Dep. of Inform.Technol. Electrical Eng.::03889 - Biela, Jürgen / Biela, Jürgen
en_US
ethz.date.deposited
2019-12-04T09:16:07Z
ethz.source
FORM
ethz.eth
yes
en_US
ethz.availability
Open access
en_US
ethz.rosetta.installDate
2019-12-04T09:38:58Z
ethz.rosetta.lastUpdated
2023-02-07T00:49:06Z
ethz.rosetta.versionExported
true
ethz.COinS
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