In-situ nanorobotic soldering of three-dimensional helical nanobelts using gold nanoink
Metadata only
Autor(in)
Alle anzeigen
Datum
2007Typ
- Conference Paper
ETH Bibliographie
yes
Altmetrics
Abstract
In this paper, we report an in-situ nanosoldering technique to make electrically conductive interconnections between three-dimensional (3D) helical micro-/nanostructures and electrodes for the nanorobotic assembly of nanoelectromechanical systems (NEMS) using gold nanoparticle ink. 3D helical nanobelts are placed onto pre-fabricated gold electrodes using nanorobotic manipulation inside a scanning electron microscope (SEM), and then deposited with gold nanoparticle ink using fountain-pen method to improve the electrical conductivity. Electrical and mechanical characterization shows the stable reduction of contact resistance and strength of the assembled structures, which is important to build 3D NEMS devices based on nanorobotic assembly. Mehr anzeigen
Publikationsstatus
publishedExterne Links
Buchtitel
Proceedings of the 7th IEEE International Conference on NanotechnologySeiten / Artikelnummer
Verlag
IEEEKonferenz
Thema
Nanorobotic assembly; Gold nanoparticle ink; Helical nanobelt; Nanosoldering; ConductivityOrganisationseinheit
03627 - Nelson, Bradley J. / Nelson, Bradley J.
ETH Bibliographie
yes
Altmetrics