Show simple item record

dc.contributor.author
Pruszko, Laura
dc.contributor.author
Gu, Hongri
dc.contributor.author
Bourgeois, Julien
dc.contributor.author
Laurillau, Yann
dc.contributor.author
Coutrix, Céline
dc.date.accessioned
2023-03-14T09:18:25Z
dc.date.available
2023-03-14T04:52:58Z
dc.date.available
2023-03-14T08:52:52Z
dc.date.available
2023-03-14T09:18:25Z
dc.date.issued
2023-02
dc.identifier.isbn
978-1-4503-9977-7
en_US
dc.identifier.other
10.1145/3569009.3572731
en_US
dc.identifier.uri
http://hdl.handle.net/20.500.11850/603048
dc.description.abstract
Modular Tangible User Interfaces (TUIs) -i.e., UIs made of small-scale physical modules- offer novel opportunities for tangible interaction thanks to their highly customizable form factor. Such modular TUIs were proposed with different shape of modules and bonding strength between them. The problem we address in this paper is the lack of knowledge of how bonding strength and shape of the modules impact usability. We present the first study exploring the impact of bonding strength and module shape on subjective user ratings when interacting with a magnetic modular prototype. We assessed three levels of bonding strength (low, mid, high) and two shapes (cubes and rounded cubes) in a controlled user study. Participants performed eight common manipulations found in the literature for (non-)modular TUIs. Experimental results showed that (1) cubic modules are overall easier and more satisfying to manipulate, except for precision and bending tasks, (2) low strength impairs UI solidity, but high strength impairs precision tasks with cubic modules.
en_US
dc.language.iso
en
en_US
dc.publisher
Association for Computing Machinery
en_US
dc.subject
Shape
en_US
dc.subject
Tangible interaction
en_US
dc.subject
Tangible User Interfaces
en_US
dc.subject
Detachability
en_US
dc.subject
Modular user interfaces
en_US
dc.subject
Bonding strength
en_US
dc.subject
Solidity
en_US
dc.title
Modular Tangible User Interfaces: Impact of Module Shape and Bonding Strength on Interaction
en_US
dc.type
Conference Paper
dc.date.published
2023-02-26
ethz.book.title
TEI '23: Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction
en_US
ethz.pages.start
1
en_US
ethz.size
15 p.
en_US
ethz.event
17th International Conference on Tangible, Embedded, and Embodied Interaction (TEI 2023)
en_US
ethz.event.location
Warsaw, Poland
en_US
ethz.event.date
February 26 - March 1, 2023
en_US
ethz.identifier.scopus
ethz.publication.place
New York, NY
en_US
ethz.publication.status
published
en_US
ethz.date.deposited
2023-03-14T04:52:59Z
ethz.source
SCOPUS
ethz.eth
yes
en_US
ethz.availability
Metadata only
en_US
ethz.rosetta.installDate
2023-03-14T08:52:54Z
ethz.rosetta.lastUpdated
2024-02-02T20:59:14Z
ethz.rosetta.versionExported
true
ethz.COinS
ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.atitle=Modular%20Tangible%20User%20Interfaces:%20Impact%20of%20Module%20Shape%20and%20Bonding%20Strength%20on%20Interaction&rft.date=2023-02&rft.spage=1&rft.au=Pruszko,%20Laura&Gu,%20Hongri&Bourgeois,%20Julien&Laurillau,%20Yann&Coutrix,%20C%C3%A9line&rft.isbn=978-1-4503-9977-7&rft.genre=proceeding&rft_id=info:doi/10.1145/3569009.3572731&rft.btitle=TEI%20'23:%20Proceedings%20of%20the%20Seventeenth%20International%20Conference%20on%20Tangible,%20Embedded,%20and%20Embodied%20Interaction
 Search print copy at ETH Library

Files in this item

FilesSizeFormatOpen in viewer

There are no files associated with this item.

Publication type

Show simple item record