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Computationally Efficient Integration of Complex Thermal Multi-Chip Power Module Models into Circuit Simulators
(2007)2007 Power Conversion Conference ProceedingsFor analyzing reliability or short-term overload conditions of power electronic systems, it is necessary to know transient temperatures of the power semiconductors. Directly coupling thermal and circuit simulators increases the simulation time by orders of magnitude, therefore making such an approach impractical. A well-known solution to this problem is to extract thermal equivalent circuits from 3D-field simulations and to insert them ...Conference Paper -
Design Tools for Power Electronics: Trends and Innovations
(2007)Proceedings - 2nd International Conference Automotive Power ElectronicsConference Paper -
New Circuit Simulation Applets for Online Education in Power Electronics
(2011)2011 5th IEEE International Conference on E-Learning in Industrial Electronics (ICELIE)Conference Paper -
Modelling the thermal coupling between internal power semiconductor dies of a water-cooled 3300V/1200A HiPak IGBT module
(2007)International Exhibition and Conference for Power Electronics, Intelligent Motion and Power Quality (PCIM Europe 2007)Conference Paper -
Novel Online Simulator for Education of Power Electronics and Electrical Engineering
(2010)The 2010 International Power Electronics Conference - ECCE ASIAConference Paper